Advanced memory technologies company Weebit Nano (ASX:WBT) and tier-1 semiconductor foundry DB HiTek have released to manufacturing a demonstration chip.
The chip is integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM) module in DB HiTek’s 130nm Bipolar-CMOS-DMOS (BCD) process. The highly integrated demo chips will be used for testing and qualification ahead of customer production, while demonstrating the performance and robustness of Weebit’s technology.
This important milestone in the collaboration between Weebit and DB HiTek was completed on-schedule as part of the technology transfer process.
The companies are working to make Weebit ReRAM available to DB HiTek customers for integration in their systems on chips (SoCs) as embedded non-volatile memory (NVM), and aim to have the technology qualified and ready for production in the second quarter of the 2025 calendar year. Weebit ReRAM is available now to select DB HiTek customers for design prototyping ahead of production.
DB HiTek’s 130nm BCD process is ideal for analog, mixed-signal and high-voltage designs in applications such as consumer, industrial, and IoT devices. For these applications, Weebit ReRAM provides a cost- effective, low-power NVM that is easy to integrate and has proven excellent retention at high temperatures. ReRAM offers significant advantages over flash for BCD processes because it is a back-end- of-line (BEOL) technology which does not require significant process tuning. Weebit ReRAM also provides higher density and endurance compared to conventional Multi-Time Programmable (MTP) technologies.
“This milestone confirms we are proceeding towards qualification of our ReRAM in DB HiTek’s BCD process on schedule, making the technology available to this leading foundry’s extensive customer base,” Coby Hanoch, CEO of Weebit Nano, said.
“We’re already in early adopter discussions with several DB HiTek customers who are interested in integrating ReRAM in their SoCs. One area of interest is smart power management integrated circuits (PMICs), where integrating the PMIC with the microcontroller (MCU) on one die can lead to performance, security, power and cost advantages.”